New Lsnt 300 Non-Destructive Testing System

Product Details
Customization: Available
After-sales Service: 1 Year
Material Range: Conductor Film, Metal Sheet and Oth

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  • New Lsnt 300 Non-Destructive Testing System
  • New Lsnt 300 Non-Destructive Testing System
  • New Lsnt 300 Non-Destructive Testing System
  • New Lsnt 300 Non-Destructive Testing System
  • New Lsnt 300 Non-Destructive Testing System
  • New Lsnt 300 Non-Destructive Testing System
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  • Overview
  • Detailed Photos
  • Product Parameters
  • Company Profile
Overview

Basic Info.

Model NO.
LSNT 300
Measurement Mode
Precise Positioning Scan
Maximum Scanning Area Size
Maximum Scanning Area Szet300 mm* 300 mm
Positioning Accuracy
5μm
Detect Minimum Line Width or Spacing
0.5 mm
Detection Maximum Depth
30 mm
Transport Package
Wooden Box
Specification
85 cm*55 cm*30 cm
Trademark
Resound
Origin
China

Product Description

Detailed Photos

New Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing System

Product Parameters


Product characteristics

High detection accuracy, simple operation method, no damage tothe sample to be tested; The samplesurface can be scanned for defects,Physical properties such asthickness, conductivity andpermeability of conductor samplessuch as conductor film and metalsheet were tested.


Productintroduction
.SNT -300 nondestructive testing system: It can detect the thickness, conductivity, permeability and other relatecphysical characteristics of conductor samples such as conductor film and metal plate under test without directcontact with the sample to be tested. At the same time, it can scan the surface of the sample for defects. lt can bewidely used to test the thickne ss, conductivity, permeablity and other physical characteristics of conductor samplessuch as conductor films and metal plates.


Specification parameter

Project content
Material range Conductor film, metal sheet and other conductor samples
Measurement mode Precise positioning scan
Maximum scanning area size 300 mm* 300 mm
Positioning accuracy 5μm
Detect minimum line width or spacing 0.5 mm
Detection maximum depth 30 mm
Size 85 cm*55 cm*30 cm


Application case/test data/photos 

Surface defect measurements were made for grooves of aluminum plate samples with different depths (i.e., defects), as shown below. The defects from left to right are: (a) surface grooves with a depth of 1mm; (b) Surface grooves with a depth of 3mm; (c) is an internal groove with a thickness of 4mm from the surface; (d) is an internal groove with a thickness of 1mm from the surface; (e) is a through-hole slot; The width of each hole and slot is 10mm. Aluminum has an electrical conductivity of 3.78X10 7 (S.m-1 ) and a permeability of 1.2566X10 -6 (H.m-1 ).

LabVIEW program was used to control the automatic scanning system to scan the surface of the sample in accordance with the red snake path set in the figure, and set the Z-axis step distance of 1.25mm each time (you can set the specific value according to the situation), the scanning area of 70×118mm, the total number of calculated measuring points is 56×94 5264 points. In order to consider the influence of skin effect and better obtain the surface topography of the sample, the detection conditions at different frequencies of 200, 500, 1500 and 5000Hz were tested respectively. The defect location was determined by high frequency first, and then the specific size and depth of the defect was further obtained by adjusting to low frequency. Finally, the surface and near-surface morphologies of the samples were obtained.
 
Company Profile

 

Resound Photoelectric Technology Research Institute (LSRPTR)

Resound Photoelectric Technology Research Institute (LSRPTR), also known as Resound Research Institute, is affiliated with China Haiheng International Trade Group Co., Ltd. (CHHGC). As an investment attraction enterprise in Zhongyuan Science and Technology City and a construction unit of the Zhongyuan Aurora Laboratory, the institute is committed to the industrialization of scientific and technological achievements, guided by market demand.

 

Technical Cooperation

Resound Research Institute has established technical cooperation with numerous well-known domestic and foreign universities, research institutes, and enterprise platforms, including:
 
Tsinghua University
Lanzhou University
Zhengzhou University
Altai State Technical University of Russia
Northwestern Polytechnical University
Chinese Academy of Engineering
Henan Academy of Sciences
China Electronics Technology Group
CGN Group
Xiamen University
Henan University
National University
University of Electronic Science and Technology of China
Chinese Academy of Sciences
China Academy of Engineering Physics
China Shipbuilding Group
China Electronics Group
Henan Inspection Group
 

Research and Development Fields

* Applications of Micro-Electromechanical and Lithography Technology
* Optoelectronics and Spectroscopy Technology
* High-Power Laser and Device Preparation Technology
* Nuclear Instrument and Emergency Equipment System Applications

 

Introducing Advanced Technologies and Products

Resound Research Institute continuously introduces advanced new technologies and products in industrial application scenarios such as market supervision, public safety, environmental monitoring, and science, education, research, and production. This has led to the formation of a domestically produced high-end scientific equipment industry base that integrates design, research and
development, production, sales, and services. This base drives the iteration of downstream industry technology, enhances the transformation and industrialization level of scientific and technological achievements, and provides technological sources for innovative development.


New Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing SystemNew Lsnt 300 Non-Destructive Testing System

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