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PRODUCT INTRODUCTION
Purpose: Using sputtering method to
deposit a few microns of thin film on the
surface of the sample, including various
metals, semiconductors, ferromagnetic
materials, as well as insulating oxides,
ceramics and other materials.
PRODUCT PARAMETER
Wafer size
≤6 inches
Vacuum degree
10 -8 Torr
Thickness uniformity error
<5%
Sputtering thickness
0-300 nm
Sputtering material
Al, Cu, Gr, Co, Fe, Ni, Pt, Ag, TiO2, NiFe and NiMn,etc
Size
170 cm*130 cm*180 cm