Surface Acoustic Wave Device Production Step Lithography Machine

Product Details
Customization: Available
After-sales Service: Factory Supply Service
Warranty: 1 Years

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  • Surface Acoustic Wave Device Production Step Lithography Machine
  • Surface Acoustic Wave Device Production Step Lithography Machine
  • Surface Acoustic Wave Device Production Step Lithography Machine
  • Surface Acoustic Wave Device Production Step Lithography Machine
  • Surface Acoustic Wave Device Production Step Lithography Machine
  • Surface Acoustic Wave Device Production Step Lithography Machine
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Basic Info.

Model NO.
LSLM-500
Wafer Size
4 Inches, 6 Inches, 8 Inches,12 Inches
Exposure Light Source
UV-LED
Resolution
0.5μm,0.4μm,0.3μm(Developed in Sequence)
Alignment Accuracy
0.15μm
Scaling Ratio
1:5
Exposure Method
Step-and-Scan Projection
Transport Package
Wooden Box
Trademark
Resound
Origin
China
HS Code
9031809090

Product Description

Surface Acoustic Wave Device Production Step Lithography Machine
Product
 characteristics    

  High  precision;
   Desktop,small   size,built-in computer
 Customizable   hardware  and  software to meet industry needs;  
Elasticity  is  suitable  for
 various  bases and shapes;


Product introduction
The LSLM-500 step lithography machine is a device used to make integrated circuits (ics), which  can  form  millions  of  microscopic  circuit  components  on  the  surface  of  tiny  silicon
wafers,an important part of a complex process.
Main  Use:Step  lithography can  be  used to  reduce the scale of the  mask  pattern onto the substrate surface to be exposed.It can be widely used in the development and production of small   and    medium-sized    integrated    circuits,semiconductor   components    and    surface
caoin(u)ss(t)ipec(c w)aifivca(e)tdio(e)n(v)s(i):(c)e(.) mask pattern can be reduced by 5 times in the same proportion for
exposure;Minimum  line  width:500nm;Can  cooperate  with  a  variety  of  models  of  positive and negative light resistance.
Sputtering       materials:metals       Al,Cu,Gr,Co,Fe,Ni,Pt,Ag,Ti,Ta;Alloy       NiFe,CoFe,CoFeB,
NiMn,FeMn,TbFeCo;Oxides     MgO,etc.
Applications:small    and    medium-sized     integrated    circuits;Semiconductor     components; Development and production of surface acoustic wave devices;
Specification   parameter

 
Project content
Chip size Four inches,six inches,eight inches,twelve inches
Exposure light source UV-LED
Light source wavelength used 365 nm
Resolving power 500 nm,400 nm and 300 nm were developed successively
Focus accuracy 150 nm
Scale Multiplier 1:5
Exposure mode Step projection
Feature size uniformity (CDU) ±10%
Dimensions 170 cm*130 cm*180 cm
Surface Acoustic Wave Device Production Step Lithography MachineSurface Acoustic Wave Device Production Step Lithography MachineSurface Acoustic Wave Device Production Step Lithography Machine

 

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