High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine

Product Details
Customization: Available
After-sales Service: Factory Supply Service
Warranty: Three Years
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  • High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
  • High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
  • High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
  • High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
  • High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
  • High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
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Basic Info.

Model NO.
LSCE-800
Wafer Size
4 Inches, 6 Inches, 8 Inches
Exposure Light Source
LED Integrated Light Source with 3 Wavelengths: 36
Resolution
3μm
Alignment Accuracy
0.3μm
0.3μm
Contact Exposure
Dimensions
170cm X 130cm X 180cm
Transport Package
Wooden Box
Specification
170cm*130cm*180cm
Trademark
Resound
Origin
China
Production Capacity
5000

Packaging & Delivery

Package Size
170.00cm * 130.00cm * 180.00cm
Package Gross Weight
60.000kg

Product Description

High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
Product characteristics  
  

·The  resolution  is  quite  accurate;
 A wider range of UV wavelengthselection;
 Support  constant  light  intensity  or  constant power  mode;
 Widely  used  in semiconductor,
microelectronics,biological  devices  and nanotechnology  fields;

Product introduction   
LSCE-800 contact exposure machine refers to that the mask plate directly contacts with the photoresist layer of the substrate,and the exposed figure has high resolution accuracy with the figure on the mask plate.The equipment is simple,and the line width can reach 800nm;A variety of models of positive and negative photoresist can be used together;It is suitable for ultraviolet or deep ultraviolet light exposure of materials ranging from special size substrates to very wide range of 4 sizes.It can be widely used in semiconductor manufacturing,optoelectronic,flat plate,RF microwave,diffractive optics,MEMS,concave convex or crystal coating equipment and other applications.
 Application field   
Semiconductor manufacturing;Optoelectronic,flat panel;Radio frequency microwave,diffraction optics; Mems;Concave-convex or coated crystal equipment.

Specification parameter    
 
Project content
Chip size Four inches,six inches,eight inches
Exposure light source 365nm,380nm,395nm Three wavelength LED integrated ight source
Resolving power 3μm
Alignment accuracy 300 nm
Scale Multiplier 1:5
Exposure mode Contact exposure
Feature size uniformity ±10%
Size 170 cm*130 cm*180 cm


High Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure MachineHigh Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure MachineHigh Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure MachineHigh Resolution Optoelectronic Components Lsce-800 Contact-Type Exposure Machine
 

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